By C. E. Jowett (auth.)
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Additional info for The Engineering of Microelectronic Thin and Thick Films
002 54 mm, it was found that the original resistive pattern artwork should be 100 to 200 times the final network size. 016 m square was utilised. Initial problems of focus and reduction tolerance were encountered. In order to eliminate thermal expansions and contractions which caused this problem, it was found necessary to control the camera room temperature at 23°C ± 1oc whilst maintaining the relative humidity between 30 and 40 per cent. Additional microfocusing was found to be due to vibration of the building housing the camera, caused by activities internal and external to the building itself.
6. Are all specified element values compatible with production processes? 7. Are all specified tolerances compatible with production processes? 8. Are specified element tolerances based on published values or need? 9. Are deratings based on production-type elements? 10. Can reliability requirements be met with proposed deratings? 11. Will production articles require changes from prototype because of any of the following environmental requirements: temperature extremes; humidity; vibration; shock?
Substrates in this condition were loaded into the vacuum chamber with the emulsion side of the substrate towards the metal film source. After the resistive film was vapour deposited over the entire substrate area, the gelatine emulsion with its resistive film coating was stripped away. This technique proved to be unsuitable for two reasons. First, caving of the photoresist produced errors in resistive film line width which were uniform across a given substrate, regardless of pattern line width.